发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.
申请公布号 US2010186223(A1) 申请公布日期 2010.07.29
申请号 US20100727349 申请日期 2010.03.19
申请人 HITACHI HIGH-TECH INSTRUMENTS CO., LTD. 发明人 WATANABE AKIO;KAWAI AKIHIRO;ONO TETSUJI;KAMEDA MAKIO;OYAMA KAZUYOSHI;IEIZUMI KAZUYOSHI
分类号 H05K13/04 主分类号 H05K13/04
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