| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a three-dimensional measuring device capable of improving measurement precision without using any telecentric optical systems. <P>SOLUTION: A substrate inspection apparatus including the three-dimensional measuring device includes: an irradiation device 4 that irradiates the surface of a printed board on which cream solder is printed with a stripe light pattern; a CCD camera 5 for imaging the part irradiated with light on the printed board; and a control unit for measuring height at respective coordinates positions on the printed board, based on image data captured by the CCD camera 5. Also, the control unit corrects deviation of measurement data generated by the angle of view of a lens 5a of the CCD camera 5, based on height Lco of the CCD camera 5 and an irradiation angle α of pattern light applied to the printed board. <P>COPYRIGHT: (C)2010,JPO&INPIT |
