| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that has excellent wettability and suppresses deposition of a polymer or an additive and a method for producing a heat-resistant pattern using the same. <P>SOLUTION: The positive photosensitive resin composition is prepared by dissolving (A) a hydroxypolyamide which is a precursor of PBO, (B) a photosensitive quinonediazide compound, and (C) a silicone-based surfactant with specific structure (hydrophilic silicone oil) in a solvent. The heat-resistant pattern is produced using the same. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| 申请公布号 |
JP2010164986(A) |
申请公布日期 |
2010.07.29 |
| 申请号 |
JP20100048724 |
申请日期 |
2010.03.05 |
| 申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
KATAOKA YASUHIRO;MARUYAMA MASAYUKI |
| 分类号 |
G03F7/023;C08G69/32;G03F7/004;H01L21/027 |
主分类号 |
G03F7/023 |
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