| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting modified polyimide resin composition improving surface hardness or tackiness of a cured film obtained by heat treatment, and suitably suppressing warpage accompanied, which composition is constituted by comprising a modified polyimide resin with an introduced soft segment comprising a polybutadiene segment or a polycarbonate segment. SOLUTION: The thermosetting modified polyimide resin composition contains a modified polyimide resin, into which soft segments made of polybutadiene segments or polycarbonate segments are introduced, and a guanamine resin. COPYRIGHT: (C)2010,JPO&INPIT
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