发明名称 |
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME |
摘要 |
Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The integrated circuit package includes an integrated circuit having a protective material on at least a portion of the integrated circuit. A lead frame is coupled to the integrated circuit and a conductive layer is also coupled to the interconnect. A solder ball is coupled to the conductive layer and a passivation layer is on the conductive layer. Active and passive components are electrically coupled to the integrated circuit. |
申请公布号 |
US2010187651(A1) |
申请公布日期 |
2010.07.29 |
申请号 |
US20090578382 |
申请日期 |
2009.10.13 |
申请人 |
STMICROELECTRONICS ASIA PACIFIC PTE LTD. |
发明人 |
JIN YONGGANG;KUWABARA KIYOSHI;BARATON XAVIER |
分类号 |
H01L23/495;H01L21/50;H01L27/06 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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