发明名称 FLEXIBLE LEITERPLATTE UND VERFAHREN ZU IHRER HERSTELLUNG
摘要 Disclosed is a flexible printed circuit, comprising a substrate, and a silver foil and a reinforcement plate attached on said substrate in order, wherein there is an ink layer between said silver foil and said reinforcement plate. According to the invention, by printing the ink onto the silver foil and then attaching the reinforcement plate, especially printing the ink in the form of a dot, strip or mesh, the total thickness of the flexible printed circuit will not increase while the surface roughness of the silver foil increases, resulting in increase of adhesion of the reinforcement plate. This strengthens the attachment between the reinforcement plate and the silver foil, meeting the requirement of peeling-resistant strength between the reinforcement plate and the silver foil.
申请公布号 DE602006014985(D1) 申请公布日期 2010.07.29
申请号 DE20066014985T 申请日期 2006.07.28
申请人 BYD CO. LTD. 发明人 ZHANG, HUA
分类号 H05K9/00;C09J7/00;H05K3/00;H05K3/38 主分类号 H05K9/00
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