CHAMFERING METHOD AND DEVICE

摘要

PROBLEM TO BE SOLVED: To provide chamfering method and device for realizing a highly accurate wafer chamfering width without being affected by dispersion of thickness and warpage of a wafer. SOLUTION: Chamfering is performed by calculating a relative position at each rotating angle of a grinding tool and the wafer W based on thickness and thickness direction position at each rotating angle at an end part of the wafer W, while adjusting a position with the grinding tool and the wafer W based on the relative position at a machining point. COPYRIGHT: (C)2010,JPO&INPIT