发明名称 EXPANDABLE RESOL TYPE PHENOLIC RESIN MOULDING MATERIAL AND PHENOLIC RESIN FOAM
摘要 PROBLEM TO BE SOLVED: To provide an expandable phenolic resin molding material which gives a phenolic resin foam having excellent strength and reduced shrinkage and a phenolic resin foam having the properties. SOLUTION: In the expandable resol type phenolic resin molding material including a liquid resol type phenolic resin, a blowing agent, a foam stabilizer, and an acid curing agent, an ammonium compound is mixed as an additive. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010163502(A) 申请公布日期 2010.07.29
申请号 JP20090005370 申请日期 2009.01.14
申请人 SEKISUI CHEM CO LTD 发明人 SHIMADA MASANORI
分类号 C08J9/04 主分类号 C08J9/04
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