| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder removing apparatus capable of preventing solder residual with high accuracy. SOLUTION: The suction port 26 at the tip end face 22 of a nozzle body 21 is pressed against solder 45. The nozzle body 21 is heated by a heater 13, with the thermal energy of the heater 13 propagated from the nozzle body 21 to the solder 45 to melt the solder 45. When the nozzle body 21 is pressed against the solder 45 in accordance with the melting of the solder 45, a protrusion 27 of the tip end face 22 is received by a component 38 for holding the solder 45, with a gap formed between the tip end face 22 and the component 38, and with the spread of the solder 45 prevented on the surface of the component 38. Simultaneously, a negative pressure generating mechanism 16 generates a negative pressure in the suction path 25. An air flow route is surely secured between the tip end face 22 and the component 38 based on the gap, so that the molten solder 45 is surely sucked in from the suction port 26 into the suction path 25. Thus, the solder 45 is removed from the component 38 with high accuracy. COPYRIGHT: (C)2010,JPO&INPIT |
