MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed is a method for manufacturing a multilayer ceramic electronic component having a thick film resistor and an overcoat layer, wherein no defects such as delamination occur and no cracks occur in the thick film resistor after laser trimming even when a method, in which an unfired composite multilayer body is fired, is employed in order to integrally fire an unfired ceramic multilayer body, an unfired thick film resistor and an unfired overcoat layer. Specifically, an unfired overcoat layer (15) is configured of a glass ceramic material which contains a ceramic and a glass that has substantially the same constituents at substantially the same composition ratio as the glass contained in an unfired ceramic layer (12).  The respective glass ceramic materials constituting the unfired ceramic layer (12) and the unfired overcoat layer (15) are adjusted so that the ratio of the crystal phase having a thermal expansion coefficient lower than the thermal expansion coefficient of the ceramic layer after firing is higher in the overcoat layer than in the ceramic layer.