| 摘要 |
PURPOSE: An led module is provided to radiate a light through a surface emitting by mounting an LED bare chip in a PCB substrate. CONSTITUTION: One or a plurality of LED bare chips(20) is or are mounted in a PCB(10). The LED bare chip emits the light. A fluorescent material layer(30) is coated on the top of the LED bare chip. An epoxy resin layer is coated the top side of the fluorescent material layer. The epoxy resin layer emits the light from the whole area thereof. |
