| 摘要 |
<P>PROBLEM TO BE SOLVED: To seal a semiconductor device with resin in an accurate position without causing displacement from an initial adhesion position of the semiconductor device on a support board due to a flowing power of sealing resin. <P>SOLUTION: A resin sealing method includes a step of aligning and adhering a semiconductor device 30 in a predetermined position on an adhesive layer 20 formed on a support 10, a step of sealing part of the semiconductor device 30 by curing a first sealing resin 40 in a flowing state to fix the semiconductor device 30 adhered in the predetermined position of the support 10, a step of setting the semiconductor device 30 fixed in the predetermined position of the support 10, into a mold and sealing with a second sealing resin 50 part of the semiconductor device 30 exposed from the first sealing resin 42, and a step of removing the support 10 and the adhering layer 20 from the resin-sealed semiconductor device 30. <P>COPYRIGHT: (C)2010,JPO&INPIT |
