| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily obtain a structure which is less apt to have chipping of a substrate, and the like, occur with respect to mechanical stress from the outside, and the like. <P>SOLUTION: A wiring substrate (package) 10 has a structure, in which a plurality of wiring layers 11, 14, 17, and 20 are laminated having insulating layers 12, 15, and 18 therebetween and the wiring layers are interlayer connected via vias 13, 16, and 19 formed in the insulating layers. Reinforcing patterns 11A, 14A, 17A, and 20A are formed in the same surface, as that in the wiring layer in a peripheral region R2 of the package. The reinforcing patterns 11A, 14A, 17A, and 20A are formed of a conductive layer formed in the same surface as the wiring layers 11, 14, 17, and 20 and are provided in the shape of a continuous ring, in a planar view. <P>COPYRIGHT: (C)2010,JPO&INPIT |
