发明名称 |
METHOD FOR MANUFACTURING PHOTOMASK, AND PHOTOMASK BLANK |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable high-accuracy etching of a light-shielding film without giving damages to a phase shift film even when no etching stopper film is used or even when a layered structure is used, the layered structure comprising a light-shielding film of a silicon-based material which is the same type of the material for the phase shift film, on the phase shift film of a silicon-based material. <P>SOLUTION: A method for manufacturing a photomask includes a following step carried out on a photomask blank. The photomask blank has a phase shift film formed on a transparent substrate and has a light-shielding film further formed on the phase shift film, wherein: each of the phase shift film and the light-shielding film has a silicon-based material layer; the silicon-based material layer of the phase shift film is adjacent to the silicon-based material layer of the light-shielding film; and the total content of nitrogen and oxygen in the silicon-based material layer of the phase shift film is different from the total content of nitrogen and oxygen in the silicon-based material layer of the light-shielding film. The method includes a step of selectively etching away the silicon-based material layer of the light-shielding film by chlorine-based dry etching with a predetermined ratio of chlorine gas to oxygen gas set. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010164777(A) |
申请公布日期 |
2010.07.29 |
申请号 |
JP20090006907 |
申请日期 |
2009.01.15 |
申请人 |
SHIN-ETSU CHEMICAL CO LTD |
发明人 |
IGARASHI SHINICHI;KANEKO HIDEO;INAZUKI SADAOMI;NISHIKAWA KAZUHIRO |
分类号 |
G03F1/32;G03F1/54;G03F1/68;G03F1/80;H01L21/027;H01L21/3065 |
主分类号 |
G03F1/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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