| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink for a power device, which can be increased in overall strength, can decrease stresses even when the stress, which occurs when the power device is assembled, or the thermal stress due to heat generation of the power device is added, and has superior cooling performance. SOLUTION: A flow passage 30, where a cooling medium 3 flows, is formed inside to cool the heat occurring from the power device 2 by the cooling medium 3. The heat sink for a power device includes a plate-like member 4 made of a metal plate having a cooling medium contact surface 40 which comes into contact with the cooling medium 3 and having a plurality of device arrangement portions 5 in which the power device 2 is arranged on the surface on the opposite side of the cooling medium contact surface 40. The plate-like member 4 has a convex-sectioned or hollow-sectioned rib portion 6, which respectively marks the boundary between device arrangement portions 5, between the adjacent device arrangement portions 5. COPYRIGHT: (C)2010,JPO&INPIT |
