发明名称 MARKING AND MARK INSPECTION METHOD FOR SEMICONDUCTOR WAFER CHIP, AND APPARATUS OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method, an apparatus and the like of maintaining ink discharging performance of an ink cartridge of a marking apparatus for a semiconductor wafer. Ž<P>SOLUTION: A method of carrying out marking for adding a mark to a chip formed on a semiconductor wafer and of carrying out mark inspection of the mark, includes: a marking step (M1, M2, and M3) of sequentially adding a mark to a chip determined as a defect based on inspection results of electronic characteristics of a plurality of chips formed on the semiconductor wafer; and a mark inspection step (K1, K2, and K3) of sequentially inspecting the mark added by the marking step. The marking step is temporarily stopped after a lapse of predetermined time period to shift to the mark inspection step. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010165734(A) 申请公布日期 2010.07.29
申请号 JP20090004828 申请日期 2009.01.13
申请人 RENESAS ELECTRONICS CORP 发明人 MATSUO KENJI
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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