发明名称 METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE
摘要 A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device.
申请公布号 US2010186894(A1) 申请公布日期 2010.07.29
申请号 US20100753533 申请日期 2010.04.02
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 MATSUMURA TAKASHI
分类号 B32B37/02 主分类号 B32B37/02
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