| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce stress accompanying a heat shrinkage of a filling resin filled between a body to be mounted and a semiconductor chip. <P>SOLUTION: A semiconductor device includes: a circuit substrate 6; the semiconductor chip 1 mounted thereupon via projecting connecting terminals 2; and the filling resin 11 filled between the circuit substrate 6 and the semiconductor chip 1 to seal the connecting terminals 2, wherein the filling resin 11 is retained inside the semiconductor chip 1 so as not to run out of three side portions, excluding the side portion where the sealing resin 9 is provided, among four side portions defining an outer peripheral portion of the semiconductor chip 1 because of the presence of a resin stop portion 7 formed on the circuit substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
