发明名称 METHOD FOR SEASONING PLASMA PROCESSING APPARATUS, AND METHOD FOR DETERMINING END POINT OF SEASONING
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for determining an end point of seasoning of a plasma processing apparatus for shortening the time required for seasoning after performing wet cleaning and determining an optimum end point of the seasoning with good repeatability. Ž<P>SOLUTION: After performing wet cleaning (S501) of the plasma processing apparatus, by using a processing gas containing SF6 as processing gas, an RF bias double that of mass production conditions is applied to perform seasoning (S502). Emission data of SiF and Ar during plasma processing are acquired under test conditions using SiF and Ar gases (S503). It is determined whether a computed value of emission intensity during seasoning is equal to or smaller than that during stable mass production (S504). When it is determined that the computed value of emission intensity during seasoning is not larger than that during stable mass production, the end point of the seasoning process is determined. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010165738(A) 申请公布日期 2010.07.29
申请号 JP20090004964 申请日期 2009.01.13
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 NISHIMORI YASUHIRO;UCHIDA TAKESHIGE;SAKAGUCHI MASAMICHI;HIROTA KOSA
分类号 H01L21/3065 主分类号 H01L21/3065
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