| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer end part processing apparatus capable of reliably and efficiently removing thin films or foreign substances formed on end parts of semiconductor wafers. SOLUTION: The wafer end part processing apparatus includes: a wafer supporting/rotating unit for supporting a plurality of wafers in an erected state in parallel with each other so that the centers of the wafers are coaxially arrayed and for simultaneously rotating the plurality of wafers around the centers of the wafers; a cleaning solution supply unit which supplies a cleaning solution while contacting with the end parts of the plurality of wafers rotated by the wafer supporting/rotating unit to remove thin films or foreign substances existing on the end parts by the cleaning solution; and a cleaning solution-removing unit for removing the cleaning solution supplied to the end parts of the plurality of wafers by the cleaning solution supply unit, wherein the end parts of the plurality of wafers are simultaneously processed in the posture of the erected state of the wafers. COPYRIGHT: (C)2010,JPO&INPIT |
