发明名称 Circuit for Detecting Tier-to-Tier Couplings in Stacked Integrated Circuit Devices
摘要 A first semiconductor tier has a first tier-to-tier connector for detecting a tier-to-tier coupling in a stacked integrated circuit (IC) device. A second semiconductor tier has a second tier-to-tier connector configured to electrically couple to the first tier-to-tier connector. A tier-to-tier detection circuit electrically couples to the second tier-to-tier connector. The tier-to-tier detection circuit generates an output signal indicative of an electrical coupling between the first semiconductor tier and the second semiconductor tier.
申请公布号 US2010188114(A1) 申请公布日期 2010.07.29
申请号 US20090360244 申请日期 2009.01.27
申请人 QUALCOMM INCORPORATED 发明人 TOMS THOMAS R.
分类号 G01R31/04;H01L21/50;H01L23/48 主分类号 G01R31/04
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