发明名称 |
Circuit for Detecting Tier-to-Tier Couplings in Stacked Integrated Circuit Devices |
摘要 |
A first semiconductor tier has a first tier-to-tier connector for detecting a tier-to-tier coupling in a stacked integrated circuit (IC) device. A second semiconductor tier has a second tier-to-tier connector configured to electrically couple to the first tier-to-tier connector. A tier-to-tier detection circuit electrically couples to the second tier-to-tier connector. The tier-to-tier detection circuit generates an output signal indicative of an electrical coupling between the first semiconductor tier and the second semiconductor tier. |
申请公布号 |
US2010188114(A1) |
申请公布日期 |
2010.07.29 |
申请号 |
US20090360244 |
申请日期 |
2009.01.27 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
TOMS THOMAS R. |
分类号 |
G01R31/04;H01L21/50;H01L23/48 |
主分类号 |
G01R31/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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