Printed circuit or electronic component e.g. coil, manufacturing method, involves applying contours of conducting paths or component elements on ceramic substrate by silver paste, such that geometrical structures are formed on substrate

摘要

The method involves applying contours of conducting paths or component elements on a ceramic substrate (2) by using a silver paste (4) in such a manner geometrical structures are formed on the ceramic substrate. The geometrical structures are formed as projections that are arranged at a distance from each other. The geometrical structures form a limited intermediate area on the ceramic substrate as side walls and limit an expansion of a tape paste over the intermediate space during filling of the tape paste into the intermediate space.