| 摘要 |
<p>An LED package structure (100) includes a carrier (110), a housing (120), an LED chip (130), an encapsulant (140) and a surface treatment layer (150). The housing is disposed on the carrier and has an upper surface (122), wherein the housing and the carrier together form a chip-containing cavity (C'). The LED chip is disposed on the carrier and located in the chip-containing cavity. The encapsulant is disposed in the chip-containing cavity and encapsulates the LED chip. The surface treatment layer is disposed on the upper surface of the housing to prevent the encapsulant from adhering to the upper surface of the housing.</p> |
