发明名称 TRANSFER MECHANISM WITH MULTIPLE WAFER HANDLING CAPABILITY
摘要 <p>An integrated robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly can comprise a multiple end effector for moving a plurality of workpieces, a single end effector for moving a single workpiece, a rotation chuck incorporated on the robot body to provide alignment capability, and an optional identification subsystem for identify the object during transport. The present invention robot assembly can be used in a sorter or stocker equipment, in processing equipment, and a transfer system.</p>
申请公布号 KR20100085065(A) 申请公布日期 2010.07.28
申请号 KR20107008839 申请日期 2008.09.22
申请人 DYNAMIC MICROSYSTEMS SEMICONDUCTOR EQUIPMENT GMBH 发明人 TABRIZI FARZAD;BARKER DAVID
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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