BONDING OF HEAT-ACTIVATED FILMS INCLUDING A PLASTICIZER
摘要
<p>Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plasticizer.</p>
申请公布号
EP2209865(A2)
申请公布日期
2010.07.28
申请号
EP20080849069
申请日期
2008.11.12
申请人
INVISTA TECHNOLOGIES S.A R.L.
发明人
COVELLI, CARMEN, A.;FARMER, DOUGLAS, K.;MASTERS, GAVIN, N.
