Power semiconductor module in pressure contact with active cooling arrangement

摘要

The power semiconductor module (10) has a substrate (14) on which the power semiconductor components (20) are arranged. A pressing device (26) is provided for pressure contacting the power semiconductor components on the substrate. The pressing device is also provided for pressure contacting a heat dissipating arrangement of the substrate on a cooling component (12). The pressing device is formed as an active cooling device (28) having a coolant which is formed by a cooling fluid.