发明名称 Multi-bit high-density memory device and architecture and method of fabricating multi-bit high-density memory devices
摘要 A structure, memory devices using the structure, and methods of fabricating the structure. The structure includes: an array of nano-fins, each nano-fin comprising an elongated block of semiconductor material extending axially along a first direction, the nano-fins arranged in groups of at least two nano-fins each, wherein ends of nano-fins of each adjacent group of nano-fins are staggered with respect to each other on both a first and a second side of the array; wherein nano-fins of each group of nano-fins are electrically connected to a common contact that is specific to each group of nano-fins such that the common contacts comprise a first common contact on the first side of the array and a second common contact on the second side of the array; and wherein each group of nano-fins has at least two gates that electrically control the conductance of nano-fins of the each group of nano-fins.
申请公布号 US7763932(B2) 申请公布日期 2010.07.27
申请号 US20060427487 申请日期 2006.06.29
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GOPALAKRISHNAN KAILASH;SHENOY ROHIT SUDHIR
分类号 H01L27/115 主分类号 H01L27/115
代理机构 代理人
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