发明名称 |
Intelligent, universal, reconfigurable electromechanical interface for modular systems assembly |
摘要 |
An electromechanical connection includes a first conductor disposed in a first non-conductive array and a second conductor disposed in a second non-conductive array capable of mating with the first non-conductive array. The second conductor is capable of mating with the first conductor when the first non-conductive array and the second non-conductive array are mated. A processor associated with the first non-conductive array determines if an electrical connection is formed between the first conductor and the second conductor. The processor can assign a function to the electrical connection.
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申请公布号 |
US7763995(B2) |
申请公布日期 |
2010.07.27 |
申请号 |
US20080053263 |
申请日期 |
2008.03.21 |
申请人 |
PHYSICAL SCIENCES, INC. |
发明人 |
JOSHI PRAKASH B.;DECKER BRIAN K.;MAGILL JOHN C.;HINDS MICHAEL F. |
分类号 |
H01B7/30;H01B11/02;H02B1/20;H02G5/06 |
主分类号 |
H01B7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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