发明名称 Intelligent, universal, reconfigurable electromechanical interface for modular systems assembly
摘要 An electromechanical connection includes a first conductor disposed in a first non-conductive array and a second conductor disposed in a second non-conductive array capable of mating with the first non-conductive array. The second conductor is capable of mating with the first conductor when the first non-conductive array and the second non-conductive array are mated. A processor associated with the first non-conductive array determines if an electrical connection is formed between the first conductor and the second conductor. The processor can assign a function to the electrical connection.
申请公布号 US7763995(B2) 申请公布日期 2010.07.27
申请号 US20080053263 申请日期 2008.03.21
申请人 PHYSICAL SCIENCES, INC. 发明人 JOSHI PRAKASH B.;DECKER BRIAN K.;MAGILL JOHN C.;HINDS MICHAEL F.
分类号 H01B7/30;H01B11/02;H02B1/20;H02G5/06 主分类号 H01B7/30
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