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发明名称
Method of forming contact plug in semiconductor device
摘要
申请公布号
KR100972704(B1)
申请公布日期
2010.07.27
申请号
KR20070064545
申请日期
2007.06.28
申请人
发明人
分类号
H01L27/115;H01L21/28
主分类号
H01L27/115
代理机构
代理人
主权项
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