发明名称 |
Semiconductor device and manufacturing method therefor |
摘要 |
It is a semiconductor device that has a semiconductor chip on which an electrode pad is formed, an electric connection member formed on the electrode pad, an insulating layer formed on the semiconductor chip, and an electrically conductive pattern connected to the electric connection member. An opening portion corresponding to the electric connection member is formed in the conductive pattern. The conductive pattern is electrically connected to the electric connection member by an electrically conducting paste embedded in the opening portion.
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申请公布号 |
US7763977(B2) |
申请公布日期 |
2010.07.27 |
申请号 |
US20070984596 |
申请日期 |
2007.11.20 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YAMANO TAKAHARU |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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