发明名称 |
Method for positioning dicing line of wafer |
摘要 |
A method for positioning a dicing line includes the steps of: bonding an adhesive tape on a semiconductor layer of a wafer; detecting an image of the wafer by an imaging device on the basis of a light transmitted through the wafer; and determining the dicing line of the wafer on the basis of a position of an image of a marker, which is disposed on the semiconductor layer of the wafer. The image of the marker is obtained by image recognition from the detected image of the wafer. |
申请公布号 |
US7763525(B2) |
申请公布日期 |
2010.07.27 |
申请号 |
US20050169579 |
申请日期 |
2005.06.30 |
申请人 |
DENSO CORPORATION |
发明人 |
GOTO KEISUKE;YOKOYAMA KENICHI |
分类号 |
H01L21/00;B81C99/00;H01L21/30 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|