发明名称 Wireless IC device and component for wireless IC device
摘要 A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
申请公布号 US7764928(B2) 申请公布日期 2010.07.27
申请号 US20070930818 申请日期 2007.10.31
申请人 MURATA MANUFACTURING CO., LTD. 发明人 DOKAI YUYA;KATO NOBORU;ISHINO SATOSHI
分类号 H04B7/00;H04B1/16 主分类号 H04B7/00
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