发明名称 |
Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways |
摘要 |
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge.
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申请公布号 |
US7762314(B2) |
申请公布日期 |
2010.07.27 |
申请号 |
US20070739160 |
申请日期 |
2007.04.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL LEVI A.;CHU RICHARD C.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SCHMIDT ROGER R.;SIMONS ROBERT E. |
分类号 |
F28F7/00;H05K7/20 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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