| 摘要 |
The method manufactures a wiring substrate. The method comprises: a recess section forming step of forming recess sections corresponding to a prescribed wiring pattern, on a substrate; a filling step of filling a conductive paste containing thinner, into the recess sections; a curing step of causing the conductive paste filled in the recess sections in the filling step to contract, by drying and curing; and a plating step of forming a wiring conductor serving as the wiring pattern, by performing a plating process using the conductive paste in contact with at least a portion of an inner circumferential face of the recess sections, as at least one of a catalyst and a current feed layer.
|
