<p>PURPOSE: A method for manufacturing a semiconductor device is provided to eliminate residue from processing units by performing purifying operations with respect to each processing unit during a substrate is transferring between the processing units. CONSTITUTION: A semiconductor substrate is loaded into a processing chamber including a plurality of processing units(S100). A substrate is being transferred along the processing units, and separate operations are performed in each processing unit(S200). While the substrate is transferred between the processing units, a purifying operation is performed with respect to each processing unit(S300). By-products and residue from the processing units are eliminated.</p>
申请公布号
KR20100084207(A)
申请公布日期
2010.07.26
申请号
KR20090003558
申请日期
2009.01.16
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, JIN HO;CHOI, GIL HEYUN;PARK, BYUNG LYUL;LEE, JONG MYEONG;CHOI ZUNG SUN;JUNG, HYE KYUNG