| 摘要 |
PURPOSE: A thermosetting adhesive composition is provided to control the outflow in pressing, to obtain an adhesive film capable of improving heat resistance to correspond to the temperature of a lead-free soldering reflow furnace, and to have excellent workability and adhesive force. CONSTITUTION: A thermosetting adhesive composition used for a flexible printed circuit board comprises a thermoplastic resin, a thermosetting resin, a hardener, a polyfunctional acylate monomer. The polyfunctional acrylate monomer has divalent ~ hexavalent functional groups. The adhesive composition includes 50-100 parts by weight of the thermosetting resin, 0.01-10 parts by weight of the hardener, and 0.0001-5 parts by weight of the polyfunctional acrylate monomer based on 100.0 parts by weight of the thermoplastic resin. |
