ANIONIC ABRASIVE PARTICLES TREATED WITH POSITIVELY-CHARGED POLYELECTROLYTES FOR CMP

摘要

The invention provides chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising an abrasiv, a liquid carrier, and a positively charged polyelectrolyte with a molecular weight of about 15,000 or more, wherein the abrasive comprises particles that are electrostatically associated with the positively charged polyelectrolyte.