| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce variance in plane resonance frequency due to variance in thickness of an insulating layer between a power supply plane and a ground plane of a multilayer printed circuit board having the same specifications. <P>SOLUTION: The multilayer printed circuit board 1 having at least one power supply plane 2 connected to a power source and the ground plane 3 opposed to the power supply plane 2 and connected to a ground respectively is characterized in that a plurality of through-holes 10 in shapes having regularity are formed only in the power supply plane 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
