| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board which can have more electrodes formed to narrow area so as to be adaptive to multiple pins of a semiconductor chip to be mounted, and to provide a semiconductor device with the printed circuit board. Ž<P>SOLUTION: On the printed circuit board, a plurality of electrodes 2 formed on a substrate surface are arranged forming a plurality of columns parallel to a side of the printed circuit board 1, and electrodes 2 forming a second column 6 positioned on a side close to a through-hole among the plurality of columns is arranged between interconnections 4 connected to electrodes 2 forming a first column 5 positioned on a side far from the through-hole. The relation of (W2+W3)/(W2-W1)≤N<((W2+W3)/(W2-W1))+1 is satisfied, wherein W1 is the width of the interconnections 4, W2 is the width of the electrodes 2, W3 is a minimum interval between the interconnections 4 and electrodes 2 on the printed circuit board 1, and N is the number (integer) of interconnections 4 connected to the electrode 2 forming the first column 5 formed between the electrodes 2 forming the second column 6. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
