| 发明名称 |
PREPREG FOR PRINTED WIRING BOARD, METAL FOIL CLAD LAMINATE AND PRINTED WIRING BOARD, AND, METHOD FOR MANUFACTURING MULTI-LAYER PRINTED WIRING BOARD |
| 摘要 |
A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material. |
| 申请公布号 |
KR100971865(B1) |
申请公布日期 |
2010.07.22 |
| 申请号 |
KR20097025696 |
申请日期 |
2005.06.22 |
| 申请人 |
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发明人 |
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| 分类号 |
H05K3/46;B29C70/50;H05K1/03 |
主分类号 |
H05K3/46 |
| 代理机构 |
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