发明名称 TRANSPARENT CONDUCTIVE FILM ENCAPSULATING MESH-LIKE STRUCTURE FORMED FROM METAL MICROPARTICLES, SUBSTRATE ON WHICH TRANSPARENT CONDUCTIVE FILM IS LAMINATED, AND METHOD FOR PRODUCING THE SAME
摘要 <p>Provided is a transparent conductive film, which is an oxide film the primary component of which is silicon oxide and which encapsulates a mesh-like structure formed from metal microparticles. Also provided is a substrate on which a transparent conductive film is laminated wherein the transparent conductive film is laminated on a glass or ceramic substrate. Further provided is a method for producing the same. The substrate on which the transparent conductive film is laminated has a high transmission rate and high conductivity, the surface is smooth, and said substrate comprises a mesh-like structure formed from metal microparticles having excellent heat resistance and weather resistance.</p>
申请公布号 WO2010082652(A1) 申请公布日期 2010.07.22
申请号 WO2010JP50504 申请日期 2010.01.18
申请人 TODA KOGYO CORPORATION;FUJICOPIAN CO.,LTD;KAKIHARA, YASUO;SUZUKI, KYOICHI 发明人 KAKIHARA, YASUO;SUZUKI, KYOICHI
分类号 H01B5/14;B32B7/02;B32B18/00;H01B13/00;H05K9/00 主分类号 H01B5/14
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