发明名称 |
TRANSPARENT CONDUCTIVE FILM ENCAPSULATING MESH-LIKE STRUCTURE FORMED FROM METAL MICROPARTICLES, SUBSTRATE ON WHICH TRANSPARENT CONDUCTIVE FILM IS LAMINATED, AND METHOD FOR PRODUCING THE SAME |
摘要 |
<p>Provided is a transparent conductive film, which is an oxide film the primary component of which is silicon oxide and which encapsulates a mesh-like structure formed from metal microparticles. Also provided is a substrate on which a transparent conductive film is laminated wherein the transparent conductive film is laminated on a glass or ceramic substrate. Further provided is a method for producing the same. The substrate on which the transparent conductive film is laminated has a high transmission rate and high conductivity, the surface is smooth, and said substrate comprises a mesh-like structure formed from metal microparticles having excellent heat resistance and weather resistance.</p> |
申请公布号 |
WO2010082652(A1) |
申请公布日期 |
2010.07.22 |
申请号 |
WO2010JP50504 |
申请日期 |
2010.01.18 |
申请人 |
TODA KOGYO CORPORATION;FUJICOPIAN CO.,LTD;KAKIHARA, YASUO;SUZUKI, KYOICHI |
发明人 |
KAKIHARA, YASUO;SUZUKI, KYOICHI |
分类号 |
H01B5/14;B32B7/02;B32B18/00;H01B13/00;H05K9/00 |
主分类号 |
H01B5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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