| 摘要 |
A multilayer printed wiring board (110) is provided with a mounting section (160) for mounting a semiconductor element on the surface; and a layered capacitor section (140) wherein first and second layer electrodes (141, 142) sandwiching a ceramic high dielectric layer (143) are provided, the first layer electrode (141) is connected with a ground line of the semiconductor element, and a second layer electrode (142) is connected with a power supply line of the semiconductor element. The number of via holes (161a), which form a part of a conductive path for electrically connecting a grounding pad (161) with the ground line of a wiring pattern and pass through the second layer electrode (141) in noncontact state, is 0.05-0.7 to the number of a first pads (161). The number of second bar-shaped conductors (162b), which form a part of a conductive path for electrically connecting a power supply pad (162) with the power supply line of the wiring pattern and pass through the first layer electrode (141) in noncontact state, is 0.05-0.7 to the number of the power supply pads (162). |
