| 摘要 |
PROBLEM TO BE SOLVED: To prevent or suppress deformation of a heat dissipation device while maintaining heat dissipating performance. SOLUTION: A radiator 20 having a radiator fin 26 sandwiched between and joined to a top plate 22 and a bottom plate 24 is provided on an insulating substrate, which can have a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin 26 is a corrugated fin that includes first regions 26a, 26d that include joint peak portions 25a, 25b joined to the bottom plate 24 and has a height h<SB>1</SB>in an amplitude direction which is substantially equal to a distance between the top plate 22 and the bottom plate 24, and second regions 26b, 26c that include non-joint peak portion 27a, 27b separated from the bottom plate 24 by a predetermined gap (d) and has a height h<SB>2</SB>in the amplitude direction which is smaller than the distance between the top plate 22 and the bottom plate 24. COPYRIGHT: (C)2010,JPO&INPIT |
