| 摘要 |
PROBLEM TO BE SOLVED: To provide a tinned material of copper or a copper alloy (hereinafter expressed as copper alloy) which has settling properties suitable as a base material of a printed wiring board terminal, inserted in a through hole of a printed board and mounted through a reflow soldering process. SOLUTION: In the tinned material, each plating phase of a Cu-phase having a thickness of 0-2.0μm, a Cu-Sn alloy phase having a thickness of 0.1-1.5μm, and a Sn-phase having a thickness of 0.1-1.5μm is formed in this order on the surface of a copper alloy having an average crystal grain diameter of 1.5-6.0μm. Following relation: (D<SB>x</SB>-D<SB>Y</SB>)≥1 (unit:μm) is established between the crystal grain diameter D<SB>x</SB>of the copper alloy and the crystal grain diameter D<SB>Y</SB>of the plating phase directly above the copper alloy. The tinned material of the copper alloy has settling properties suitable for printed board terminals. In the tinned material of the copper alloy, the total concentration of C and S in the plating phase directly above the copper alloy may be within the range of 0.02-0.2 mass% and the copper alloy may contain 2-22 mass% of Zn. COPYRIGHT: (C)2010,JPO&INPIT
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