ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESION SHEET, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition highly satisfying low-temperature adhesiveness and reflow resistance. SOLUTION: The adhesive composition includes a thermoplastic resin (A) and a thermosetting component (B), wherein the thermosetting component (B) comprises an imide-modified phenol resin (B1). COPYRIGHT: (C)2010,JPO&INPIT