| 摘要 |
The present invention relates to an apparatus for measuring an external pressure applied to the Z axis of the chuck plate of a wafer prober. The apparatus includes a plurality of sensors (2121 to 2124) installed at preset locations between a Z axis base (208), which supports a Z axis transfer device for transferring a chuck plate (200) along the Z axis, and an XY stage (210), which is attached to a bottom of the Z axis base and is configured to transfer the chuck plate along X and Y axes, thus sensing pressures. A control device (504) stores values, sensed by the plurality of sensors at a time of initially installing the wafer prober, as initial set values and detects external pressure applied to the Z axis on a basis of differences between values sensed by the plurality of sensors and the initial set values. |
