发明名称 POWER CIRCUIT WIRING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power circuit wiring device capable of accurately reducing a local temperature rise at an electric connection portion between a circuit board made of a printed circuit board 1 and a power supply portion composed of a power module 2. SOLUTION: The power circuit wiring device includes the power supply portion composed of a power module 2 having screw terminal portions with screws 4, a first heat dissipation member 3 configured to cool the power module 2, the circuit board composed of the printed circuit board 1 configured to electrically connecting a circuit component (not illustrated) to the power module 2, and a second heat dissipation member 6 assembled together when the screw terminal portions and printed circuit board 1 are fastened together with the screws 4. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010161417(A) 申请公布日期 2010.07.22
申请号 JP20100089083 申请日期 2010.04.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKADA MASAKI;KUMAGAI TAKASHI;HAYASHI KENICHI;MORIMOTO JUNJI;NASU MOTOYUKI;TAKADA SHIGEO
分类号 H05K7/20;H01L23/36;H01L23/40 主分类号 H05K7/20
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