| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for a package substrate, which is mounted on a wiring substrate with an extension substrate interposed to improve connection reliability of the extension substrate, wiring substrate, and package substrate, and to provide an electronic component. SOLUTION: The mounting structure for the package substrate includes the package substrate 125 on which the electronic component 140 is mounted, the wiring substrate 130 on which the package substrate 125 is mounted, the extension substrate 110 provided between the package substrate 125 and wiring substrate 130 and connected to the package substrate 125 and wiring substrate 130, and a center lock mechanism part 150 disposed concentrically with the package substrate 125 and engaging a screw part 104 provided in a perpendicular direction to steplessly and continuously adjust the load placed on the package substrate 125 or wiring substrate 130 or the position thereof. COPYRIGHT: (C)2010,JPO&INPIT |
