| 摘要 |
Methods and devices used for the encapsulation of MEMS devices, such as an interferometric modulator, are disclosed. Encapsulation is provided to MEMS devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer (300) providing protection from environmental hazards, the encapsulation layer (300) is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer (300). |
