An apparatus for monitoring the thickness of a conductive layer on a substrate includes a support to hold a substrate having a conductive layer, an eddy current monitoring system including a first plurality of core portions, and a motor to cause relative motion between the support and the eddy current monitoring system such that the substrate moves across the first plurality of core portions in a direction that defines a first axis. At least one core portion is positioned further from a second axis than at least two other core portions. The second axis is orthogonal to the first axis.
申请公布号
WO2010056769(A3)
申请公布日期
2010.07.22
申请号
WO2009US64067
申请日期
2009.11.11
申请人
APPLIED MATERIALS, INC.;IRAVANI, HASSAN G.;CARLSSON, INGEMAR;SWEDEK, BOGUSLAW A.
发明人
IRAVANI, HASSAN G.;CARLSSON, INGEMAR;SWEDEK, BOGUSLAW A.